 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| v00.0302 MICROWAVE CORPORATION HMC292LM3C GaAs MMIC DOUBLE-BALANCED SMT MIXER, 17 - 31 GHz Typical Applications The HMC292LM3C is ideal for: * Microwave Point to Point Radios * Multi-Point/LMDS Radios * SATCOM Features Input IP3: +19 dBm LO / RF Isolation: 25 to 40 dB Passive: No DC Bias Required Leadless SMT Package, 25mm2 Functional Diagram General Description The HMC292LM3C is a 17 - 31 GHz surface mount passive GaAs MMIC double-balanced mixer in a SMT leadless chip carrier package. The mixer can be used as a downconverter or upconverter. Excellent isolations are provided by on-chip baluns, which require no external components and no DC bias. All data is with the nonhermetic, epoxy sealed LM3C packaged device mounted in a 50 Ohm test fixture. Utilizing the HMC292LM3C eliminates the need for wirebonding, thereby providing a consistent connection interface for the customer. 12 MIXERS - SMT Electrical Specifications, TA = +25 C LO= +13 dBm, IF= 1 GHz Parameter Min. Frequency Range, RF & LO Frequency Range, IF Conversion Loss Noise Figure (SSB) LO to RF Isolation LO to IF Isolation RF to IF Isolation IP3 (Input) IP2 (Input) 1 dB Gain Compression (Input) 26 20 22 17 45 8 Typ. 18 - 28 DC - 6 7.5 7.5 35 25 33 19 50 12 9.5 9.5 Max. LO= +13 dBm, IF= 1 GHz Units Min. Typ. 17 - 31 DC - 6 8 8 21 20 20 15 42 8 32 25 30 19 50 12 11 11 Max. GHz GHz dB dB dB dB dB dBm dBm dBm 12 - 114 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com v00.0302 MICROWAVE CORPORATION HMC292LM3C GaAs MMIC DOUBLE-BALANCED SMT MIXER, 17 - 31 GHz Conversion Gain vs. Temperature @ LO = +13 dBm 0 +25 C -40 C +85 C Isolation @ LO = +13 dBm 0 RF/IF LO/RF LO/IF CONVERSION GAIN (dB) -10 ISOLATION (dB) -5 -20 -10 -30 -15 -40 -20 15 20 25 FREQUENCY (GHz) 30 35 -50 15 20 25 FREQUENCY (GHz) 30 35 12 MIXERS - SMT Conversion Gain vs. LO Drive 0 LO = + 9 dBm LO = + 11 dBm LO = + 13 dBm LO = + 15 dBm RF & LO Return Loss @ LO = +13 dBm 0 LO RF CONVERSION GAIN (dB) RETURN LOSS (dB) -5 -5 -10 -10 -15 -15 -20 15 20 25 FREQUENCY (GHz) 30 35 -20 15 20 25 FREQUENCY (GHz) 30 35 IF Bandwidth @ LO = +13 dBm 0 Upconverter Performance Conversion Gain @ LO = +13 dBm 0 -5 RESPONSE (dB) CONVERSION GAIN (dB) -5 -10 -10 -15 RETURN LOSS CONVERSION GAIN -15 -20 0 2 4 6 8 10 IF FREQUENCY (GHz) -20 15 20 25 FREQUENCY (GHz) 30 35 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com 12 - 115 v00.0302 MICROWAVE CORPORATION HMC292LM3C GaAs MMIC DOUBLE-BALANCED SMT MIXER, 17 - 31 GHz Input IP3 vs. LO Drive 25 20 INPUT IP3 (dBm) Input IP3 vs. Temperature @ LO = +13 dBm 25 20 INPUT IP3 (dBm) 15 10 5 0 -5 -40 C +25 C +85 C 15 10 5 0 LO= 8 dBm LO= 10 dBm LO= 13 dBm 12 MIXERS - SMT -5 15 20 25 FREQUENCY (GHz) 30 35 15 20 25 FREQUENCY (GHz) 30 35 Input IP2 vs. LO Drive 80 70 60 INPUT IP2 (dBm) Input IP2 vs. Temperature @ LO = +13 dBm 80 70 60 INPUT IP2 (dBm) 50 40 30 -40 C 50 40 30 20 10 0 15 20 25 FREQUENCY (GHz) 30 35 LO= 8 dBm LO= 10 dBm LO= 13 dBm 20 10 0 15 20 25 FREQUENCY (GHz) +25 C +85 C 30 35 Input P1dB vs. Temperature @ LO = +13 dBm 15 MxN Spurious Outputs nLO mRF 0 1 0 xx 17 1 11 0 70 39 77 93 >110 76 69 >110 86 >110 2 3 4 13 INPUT P1dB (dBm) 11 9 -40 C 2 3 4 7 +25 C +85 C 5 15 20 25 FREQUENCY (GHz) 30 35 RF= 21 GHz @ -10 dBm LO= 22 GHz @ +13 dBm All values in dBc below the IF power level. 12 - 116 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com v00.0302 MICROWAVE CORPORATION HMC292LM3C GaAs MMIC DOUBLE-BALANCED SMT MIXER, 17 - 31 GHz Absolute Maximum Ratings RF / IF Input LO Drive Storage Temperature Operating Temperature +13 dBm +27 dBm -65 to +150 deg C -40 to +85 deg C 12 MIXERS - SMT NOTES: 1. MATERIAL: PLASTIC 2. PLATING: GOLD OVER NICKEL 3. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 4. ALL TOLERANCES ARE 0.005 [ 0.13]. 5. ALL GROUNDS MUST BE SOLDERED TO PCB RF GROUND. 6. Outline Drawing * INDICATES PIN 1 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com 12 - 117 v00.0302 MICROWAVE CORPORATION HMC292LM3C GaAs MMIC DOUBLE-BALANCED SMT MIXER, 17 - 31 GHz Pin Descriptions Pin Number Function Description This pin may be connected to the housing ground or left unconnected. Interface Schematic 1, 2, 3 N/C 4 RF RF Port. This pin is DC coupled and matched to 50 Ohm from 18 - 31 GHz 12 MIXERS - SMT 5 IF IF Port. This pin is DC coupled. For applications not requiring operation to DC, this port should be DC blocked externally using a series capacitor whose value has been chosen to pass the necessary IF frequency range. For operation to DC, this pin must not source/sink more than 2 mA of current or die non-function and possible die failure will result. 6 LO LO Port. This pin is DC coupled and matched to 50 Ohm from 18 - 31 GHz. GND Package base must be soldered to PCB RF ground. 12 - 118 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com v00.0302 MICROWAVE CORPORATION HMC292LM3C GaAs MMIC DOUBLE-BALANCED MIXER, 18 - 31 GHz Evaluation PCB 12 MIXERS - SMT 12 - 119 The grounded Co-Planar Wave Guide (CPWG) PCB input/output transitions allow use of Ground-SignalGround (GSG) probes for testing. Suggested probe pitch is 400mm (16 mils). Alternatively, the board can be mounted in a metal housing with 2.4 mm coaxial connectors. Evaluation Circuit Board Layout Design Details Layout Technique Material Dielectric Thickness Microstrip Line Width CPWG Line Width CPWG Line to GND Gap Ground Via Hole Diameter Micro Strip to CPWG Rogers 4003 with 1/2 oz. Cu 0.008" (0.20 mm) 0.018" (0.46 mm) 0.016" (0.41 mm) 0.005" (0.13 mm) 0.008" (0.20 mm) LM3 package mounted to evaluation PCB For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com v00.0302 MICROWAVE CORPORATION HMC292LM3C GaAs MMIC DOUBLE-BALANCED SMT MIXER, 17 - 31 GHz Suggested LM3-C PCB Land Pattern Tolerance: 0.003" ( 0.08 mm) 12 MIXERS - SMT 12 - 120 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com v00.0302 MICROWAVE CORPORATION HMC292LM3C GaAs MMIC DOUBLE-BALANCED SMT MIXER, 17 - 31 GHz HMC292LM3C Recommended SMT Attachment Technique Preparation & Handling of the LM3-C Millimeterwave Package for Surface Mounting The HMC LM3-C package was designed to be compatible with high volume surface mount PCB assembly processes. The LM3-C package requires a specific mounting pattern to allow proper mechanical attachment and to optimize electrical performance at millimeterwave frequencies. This PCB layout pattern can be found on each LM3-C product data sheet. It can also be provided as an electronic drawing upon request from Hittite Sales & Application Engineering. Follow these precautions to avoid permanent damage: Cleanliness: Observe proper handling procedures to ensure clean devices and PCBs. LM3-C devices should remain in their original packaging until component placement to ensure no contamination or damage to RF, DC & ground contact areas. 225 200 TEMPERATURE ( C) 175 150 125 100 75 50 25 0 1 2 3 4 5 TIME (min) 6 7 8 0 12 MIXERS - SMT 12 - 121 Static Sensitivity: Follow ESD precautions to protect against ESD strikes. General Handling: Handle the LM3-C package on the top with a vacuum collet or along the edges with a sharp pair of bent tweezers. Avoiding damaging the RF, DC, & ground contacts on the package bottom. Do not apply excess pressure to the top of the lid. Solder Materials & Temperature Profile: Follow the information contained in the application note. Hand soldering is not recommended. Conductive epoxy attachment is not recommended. Solder Paste Solder paste should be selected based on the user's experience and be compatible with the metallization systems used. See the LM3-C data sheet Outline drawing for pin & ground contact metallization schemes. Solder Paste Application Solder paste is generally applied to the PCB using either a stencil printer or dot placement. The volume of solder paste will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical & electrical performance. Excess solder may create unwanted electrical parasitics at high frequencies. Solder Reflow The soldering process is usually accomplished in a reflow oven but may also use a vapor phase process. A solder reflow profile is suggested above. Prior to reflowing product, temperature profiles should be measured using the same mass as the actual assemblies. The thermocouple should be moved to various positions on the board to account for edge and corner effects and varying component masses. The final profile should be determined by mounting the thermocouple to the PCB at the location of the device. Follow solder paste and oven vendor's recommendations when developing a solder reflow profile. A standard profile will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock. Allow enough time between reaching pre-heat temperature and reflow for the solvent in the paste to evaporate and the flux to completely activate. Reflow must then occur prior to the flux being completely driven off. The duration of peak reflow temperature should not exceed 15 seconds. Packages have been qualified to withstand a peak temperature of 235C for 15 seconds. Verify that the profile will not expose device to temperatures in excess of 235C. Cleaning A water-based flux wash may be used. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com |
Price & Availability of HMC292LM3C
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |